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Circuit board manufacturing,pcb manufacturer in china
- Layers: 2
- Material: FR4
- Finished Thickness: 1.57mm +/- 10%
- Outer Layer Copper Thickness: 1oz
- Finish: ENIG (Au:2-5u")
- Soldermask (Color): Both Sides, LPI (Black)
- Silkscreen (Color): Both Sides, White
Layers: 2
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White
Electrical test
FINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012.
THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL.
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED, EXCEPT VIAS .500 FINISH OR SMALLER.
Layer Key:
==========
*.GM4: Board Outline
*.TXT: NC Drill File
*.GTP: Top Paste
*.GTO: Top Silkscreen
*.GTS: Top Soldermask
*.GTL: Top Copper Layer
*.GBL: Bottom Copper Layer
*.GBS: Bottom Soldermask
*.GBO: Bottom Silkscreen
*.GBP: Bottom Paste
Material: FR4
Finished Thickness: 1.57mm +/- 10%
Outer Layer Copper Thickness: 1oz
Finish: ENIG (Au:2-5u")
Soldermask (Color): Both Sides, LPI (Black)
Silkscreen (Color): Both Sides, White
Electrical test
FINISH: THIS BOARD SHALL BE IMMERSION GOLD PLATED ACCORDING TO IPC-6012.
THICKNESS SHALL BE .050uM OVER 3-6uM NICKEL.
COPPER PLATE HOLES MINIMUM .025 AVG, .020 MIN.. HOLES MAY NOT BE PLUGGED, EXCEPT VIAS .500 FINISH OR SMALLER.
Layer Key:
==========
*.GM4: Board Outline
*.TXT: NC Drill File
*.GTP: Top Paste
*.GTO: Top Silkscreen
*.GTS: Top Soldermask
*.GTL: Top Copper Layer
*.GBL: Bottom Copper Layer
*.GBS: Bottom Soldermask
*.GBO: Bottom Silkscreen
*.GBP: Bottom Paste
Tag:
Double-side
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